Used E850 Wafer Coating Machine / Electron Beam Coating Machine / Semiconductor Evaporation Plating Machine

Detailed Introduction:

Vacuum chamber dimensions (diameter × height) φ900×1000, ultimate vacuum 3.0×10⁻⁴ Pa, vacuum recovery time 4.0×10⁻³ Pa 15 min, pumping system diffusion pump TK-500×2, roots pump ZJP-300, mechanical pump 2X-70. Features a high pumping speed vacuum system with a cryogenic device, excellent dynamic vacuum capability, meeting the requirements for high-efficiency production. Larger loading capacity; for coating large-sized flat products, a flat fixture can be equipped. Equipped with a specially designed single electron gun for this series of coating machines, ensuring a flat and pit-free coating surface and stable evaporation distribution. Can be configured with an online reflectivity monitoring system for good product consistency. Leybold, model: APS1104, empty chamber dimensions: 1100*1200 mm, cryogenic device: temperature -135°C, pumping speed 90,000 L/s, power 7.5 kW, vacuum performance: ultimate 5×10⁻⁴ Pa, pumping speed: from atmosphere to 5×10⁻³ Pa in less than 10 minutes, pressure rise time: from 1×10⁻³ Pa to 1×10⁻¹ Pa greater than 10 minutes. Rotating fixture: spherical or flat, 5-20 rpm/vertical planetary fixture. Electron gun: single or dual gun/resistance + magnetron sputtering ion source: rectangular ion source. Crystal thickness monitor: SQC-310 (full Chinese operation interface). Broadband monitoring: 400-1200 nm multi-piece reflection.

Application:

Various materials, such as metals, semiconductors, insulators, etc. It has the advantages of simple equipment, easy control, large coating area, and strong adhesion. Magnetron sputtering has developed to this day, in addition to the general advantages of the aforementioned sputtering methods, it also achieves high speed, low temperature, and low damage. Below are the six major applications of magnetron sputtering.

Various functional films: with functions such as absorption, transmission, reflection, refraction, polarization. For example, depositing silicon nitride anti-reflection films at low temperatures to improve the photoelectric conversion efficiency of solar cells.

Inventory Details: